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Virtual drop test methodology for a MEMS-based sensor

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dc.contributor.authorSeo, S.-
dc.contributor.authorOh, S.W.-
dc.contributor.authorHan, S.-
dc.date.accessioned2021-08-03T05:43:39Z-
dc.date.available2021-08-03T05:43:39Z-
dc.date.issued2011-
dc.identifier.issn1738-8090-
dc.identifier.issn2093-6788-
dc.identifier.urihttps://www.kriso.re.kr/sciwatch/handle/2021.sw.kriso/1117-
dc.description.abstractVirtual drop test methodology based on a set of simulations is developed to evaluate the shock reliability of a MEMS (Micro Electro Mechanical System)-based sensor. The methodology consists of (1) FEM (Finite Element Method) analyses to extract the equivalent parameters of the packaged sensor, (2) a high-level simulation to determine the overall responses caused by an impact on a rigid concrete floor, and (3) another FEM simulation to evaluate whether or not the device withstands the shock by comparing the maximum stress level to the yield strengths of the materials that comprise the device. The proposed methodology accounts for the dynamic shock response as well as the stress distribution in the microstructure encapsulated by the package and thus provide insight into methods of improving the design of the device. Hence, it is expected that the proposed methodology will contribute to the effective development of robust MEMS-based sensors and their successful commercialization. ? 2011 The Korean Institute of Metals and Materials and Springer Netherlands.-
dc.format.extent5-
dc.language영어-
dc.language.isoENG-
dc.titleVirtual drop test methodology for a MEMS-based sensor-
dc.typeArticle-
dc.publisher.location대한민국-
dc.identifier.doi10.1007/s13391-011-0604-y-
dc.identifier.scopusid2-s2.0-79960113496-
dc.identifier.bibliographicCitationElectronic Materials Letters, v.7, no.2, pp 109 - 113-
dc.citation.titleElectronic Materials Letters-
dc.citation.volume7-
dc.citation.number2-
dc.citation.startPage109-
dc.citation.endPage113-
dc.type.docTypeArticle-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.description.journalRegisteredClasskciCandi-
dc.subject.keywordPlusConcrete floor-
dc.subject.keywordPlusDrop test-
dc.subject.keywordPlusEquivalent parameters-
dc.subject.keywordPlusFEM (finite element method)-
dc.subject.keywordPlusFEM simulations-
dc.subject.keywordPlusMaximum stress-
dc.subject.keywordPlusMEMS (microelectromechanical system)-
dc.subject.keywordPlusMEMS-based sensors-
dc.subject.keywordPlusshock-
dc.subject.keywordPlusShock reliability-
dc.subject.keywordPlusShock response-
dc.subject.keywordPlussimulation-
dc.subject.keywordPlusConcrete construction-
dc.subject.keywordPlusDrops-
dc.subject.keywordPlusFinite element method-
dc.subject.keywordPlusMicroelectromechanical devices-
dc.subject.keywordPlusSensors-
dc.subject.keywordPlusStress concentration-
dc.subject.keywordPlusYield stress-
dc.subject.keywordPlusMEMS-
dc.subject.keywordAuthordrop test-
dc.subject.keywordAuthorMEMS-
dc.subject.keywordAuthorreliability-
dc.subject.keywordAuthorshock-
dc.subject.keywordAuthorsimulation-
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